calculate_chip_cost
ActiveTool of Silicon Analysts
Pure-function chip cost estimator. Given die dimensions (mm), process node, and optional packaging/HBM parameters, returns: estimatedChipCost (USD), dieArea (mm²), grossDiesPerWafer, frontendYield (%), totalYield (%), and a costBreakdown {waferCostPerGoodDie, packagingAndTestCost, hbmCost, marginCost}. USE THIS for: hypothetical chip cost modeling, sensitivity analysis, fabless tapeout decisions. DO NOT USE for: published cost of an existing accelerator (use get_accelerator_costs); wafer pricing only (use get_wafer_pricing). Required: dieWidth, dieHeight (1–33 mm reticle limit). Errors with INVALID_PARAMS if outside bounds. processNode defaults to tsmc-n5; valid nodes via get_wafer_pricing. Estimates are directional ±15–20%. Optional energy adder: pass energyRegion (texas|ohio|arizona|china|korea|taiwan|germany) to get a conditional `energy` block — regional manufacturing-electricity cost per die (SA estimate; wafer price already embeds foundry energy, so treat it as a scenario delta). energyFacilityOverhead=false drops the ~1.75× facility multiplier. Optional substrate scenario: pass substrate=panel-310x310 to model CoPoS panel-level assembly — applies the midpoint of Yole's realistic 20–30% panel cost-savings band to the packaging cost ONLY (silicon GDPW unchanged; panels are back-end). Conditional `substrateScenario` block + SA-scenario meta note. TSMC CoPoS: pilot ~June 2026, mass production 2028–29 — a forward-looking scenario, not a quote.
Parameters schema
{
"type": "object",
"$schema": "http://json-schema.org/draft-07/schema#",
"required": [
"dieWidth",
"dieHeight"
],
"properties": {
"volume": {
"type": "number"
},
"hbmCost": {
"type": "number"
},
"dieWidth": {
"type": "number",
"maximum": 33,
"exclusiveMinimum": 0
},
"testCost": {
"type": "number"
},
"dieHeight": {
"type": "number",
"maximum": 33,
"exclusiveMinimum": 0
},
"hbmStacks": {
"type": "number"
},
"substrate": {
"enum": [
"wafer-300mm",
"panel-310x310"
],
"type": "string"
},
"waferCost": {
"type": "number"
},
"yieldModel": {
"type": "string"
},
"processNode": {
"type": "string"
},
"backendYield": {
"type": "number"
},
"energyRegion": {
"enum": [
"texas",
"ohio",
"arizona",
"china",
"korea",
"taiwan",
"germany"
],
"type": "string"
},
"marginTarget": {
"type": "number"
},
"defectDensity": {
"type": "number"
},
"packagingCost": {
"type": "number"
},
"packagingType": {
"type": "string"
},
"kgdTestCoverage": {
"type": "number",
"maximum": 100,
"minimum": 0
},
"energyFacilityOverhead": {
"type": "boolean"
}
}
}No endpoints wrapped at confidence ≥ 0.50.
Parent server
Silicon Analysts
https://github.com/SiliconAnalysts/silicon-analysts-nextjs
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